By Loren Bliese
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Extra info for A generative grammar of Afar
Solder Screening onto the PCB Stencil screening the solder paste onto the PCB is commonly used in the industry. 005 in). The sidewalls of the stencil openings should be tapered approximately 5° to facilitate the release of the paste when the stencil is removed from the PCB. The stencil opening should be the same size as the PCB mounting pad. The exception is when there is a large center flag on the device. Then the stencil opening should allow for 70−80% coverage of the PCB mounting pad. This opening should also be divided into smaller cavities to aid in the flow of solder during the reflow process (see Figure 13).
However, the edges must be broken to remove burrs which cause poor contact between device and heatsink and may puncture isolation material. Thermal Compounds (Grease) Joint compounds are a formulation of fine zinc or other conductive particles in a silicone oil or other synthetic base fluid which maintains a grease−like consistency with time and temperature. Since some of these compounds do not spread well, they should be evenly applied in a very thin layer using a spatula or lintless brush, and wiped lightly to remove excess material.
As a general practice however, it is better to support the package. A plastic support for the TO−220 Package and other similar types is offered by heatsink accessory vendors. In many situations, because its leads are fairly heavy, the Case 77 (TO−225AA) (TO−127) package has supported a small heatsink; however, no definitive data is available. When using a small heatsink, it is good practice to have the sink rigidly mounted such that the sink or the board is providing total support for the semiconductor.
A generative grammar of Afar by Loren Bliese